CAJ | 학술논문

随着线路板布线密度的提高,阻焊桥宽度的逐渐减小,阻焊前处理日益显示其重要的地位,线路板表面的前处理效果直接影响着阻焊的良品率。本文通过扫描电镜、金相显微镜和3M胶带拉力测试等分析方法,分别对针刷＋不织布磨板、火山灰磨板,以及喷砂等几种前处理方式对阻焊桥板的效果进行了分析,并分别从无铅喷锡、化学沉镍金、化学沉锡等表面处理效果角度分析阻焊层受攻击程度,最终确定阻焊桥板制作的最佳前处理方式。
수착선로판포선밀도적제고,조한교관도적축점감소,조한전처리일익현시기중요적지위,선로판표면적전처리효과직접영향착조한적량품솔。본문통과소묘전경、금상현미경화3M효대랍력측시등분석방법,분별대침쇄＋불직포마판、화산회마판,이급분사등궤충전처리방식대조한교판적효과진행료분석,병분별종무연분석、화학침얼금、화학침석등표면처리효과각도분석조한층수공격정도,최종학정조한교판제작적최가전처리방식。
As the circuit layout density becomes higher and higher and the width of the solder mask bridges starts to shorten,the solder mask pre-treatment is showing its critical position in the PCB manufacturing.The pre-treatment quality will determine the solder mask quality directly.The paper analyses the influence of the different pre-treatments（pin brush＋ nonwoven scrubbing,pumice scrubbing,sand blasting,etc） on the solder mask bridge boards with the help of SEM,metallographic microscope and 3M tape tension test.And in terms of the different pre-treatments,like the lead-free HASL,immersion Ni-Au,and immersion Sn,the paper studies the influence grade of the solder mask layer,and it finally determines the optimum pre-treatment method of the manufacturing of the solder mask bridge boards.