电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2012年
5期
7-9,40
,共4页
电子封装%划片机%划片工艺%操作%维修%维护
電子封裝%劃片機%劃片工藝%操作%維脩%維護
전자봉장%화편궤%화편공예%조작%유수%유호
Electronic packing%Dicing machine%Dicing process%Operation%Maintenance
划片是电子器件封装工艺中重要的工艺之一,是将一整片晶圆切割成每个独立的个体,芯片切割的质量直接影响封装的质量和器件的性能。划片机有SAW类型的划片机,还有激光划片机。作者多年以来一直从事划片工艺,现对在用的ADT7100机器的结构、维修和维护作介绍,同时简单分析划片工艺。
劃片是電子器件封裝工藝中重要的工藝之一,是將一整片晶圓切割成每箇獨立的箇體,芯片切割的質量直接影響封裝的質量和器件的性能。劃片機有SAW類型的劃片機,還有激光劃片機。作者多年以來一直從事劃片工藝,現對在用的ADT7100機器的結構、維脩和維護作介紹,同時簡單分析劃片工藝。
화편시전자기건봉장공예중중요적공예지일,시장일정편정원절할성매개독립적개체,심편절할적질량직접영향봉장적질량화기건적성능。화편궤유SAW류형적화편궤,환유격광화편궤。작자다년이래일직종사화편공예,현대재용적ADT7100궤기적결구、유수화유호작개소,동시간단분석화편공예。
Dicing is one of the important processes in electronic packaging, and dicing machine can slice whole wafer into individual parts. The quality of dicing will affect the quality of packaging and quality of device. I have been working for more than ten years in dicing process. Now, I＇d like to write something about the structure,operation and maintenance of ADT7100 dicing machine, and analysis the process of dicing simply.
