CAJ | 학술논문

进行了LTCC基板上金丝热超声楔焊的正交试验,在热台温度和劈刀安装长度等条件不变的情况下,分别设置第一键合点和第二键合点的超声功率、超声时间和键合力三因素水平,试验结果表明第一点超声功率和第二点超声时间对键合强度影响明显。
진행료LTCC기판상금사열초성설한적정교시험,재열태온도화벽도안장장도등조건불변적정황하,분별설치제일건합점화제이건합점적초성공솔、초성시간화건합력삼인소수평,시험결과표명제일점초성공솔화제이점초성시간대건합강도영향명현。
The orthogonal test for thermo-sonic wedge bonding on LTCC circuit board is discussed. Ultrasonic power, ultrasonic time and bonding force parameters are given for the first bond and the second bond by holding the temperature of heater and length of capillary. Ultrasonic power for first bond and ultrasonic time for second bond are effective for wire bonding strength by the experiment.