绝缘材料
絕緣材料
절연재료
INSULATING MATERIALS
2014年
1期
56-59,65
,共5页
朱伟%曾亮%高敬民%姜其斌%李鸿岩
硃偉%曾亮%高敬民%薑其斌%李鴻巖
주위%증량%고경민%강기빈%리홍암
环氧树脂%环氧灌封胶%无机填料%力学性能
環氧樹脂%環氧灌封膠%無機填料%力學性能
배양수지%배양관봉효%무궤전료%역학성능
epoxy resin%epoxy pouring sealant%inorganic filler%mechanical properties
以双酚A环氧树脂E51和DER331混合物为主体树脂，使用酸酐类固化剂，配合稀释剂及环氧增韧剂， DMP-30为固化促进剂，活性硅微粉等为填料，制备了高性能电子环氧灌封胶，并分析了各组分对环氧灌封胶性能的影响。结果表明：经过优化配方后的环氧灌封胶力学性能好，介电性能优异，与国外同类灌封胶比较，各项性能均优于国外产品，适用于大功率电子元件的灌封。
以雙酚A環氧樹脂E51和DER331混閤物為主體樹脂，使用痠酐類固化劑，配閤稀釋劑及環氧增韌劑， DMP-30為固化促進劑，活性硅微粉等為填料，製備瞭高性能電子環氧灌封膠，併分析瞭各組分對環氧灌封膠性能的影響。結果錶明：經過優化配方後的環氧灌封膠力學性能好，介電性能優異，與國外同類灌封膠比較，各項性能均優于國外產品，適用于大功率電子元件的灌封。
이쌍분A배양수지E51화DER331혼합물위주체수지，사용산항류고화제，배합희석제급배양증인제， DMP-30위고화촉진제，활성규미분등위전료，제비료고성능전자배양관봉효，병분석료각조분대배양관봉효성능적영향。결과표명：경과우화배방후적배양관봉효역학성능호，개전성능우이，여국외동류관봉효비교，각항성능균우우국외산품，괄용우대공솔전자원건적관봉。
Using the mixture of bisphenol A epoxy resin E51 and DER331 as main resin, acid anhydride as curing agent, self-made toughening agent as additive,DMP-30 as curing accelerator, active silica powder as filler, a high performance electronic epoxy pouring sealant was prepared, and the effects of different components on the properties of the epoxy pouring sealant were analyzed. The results show that the epoxy pouring sealant has good mechanical and dielectric properties after optimizing formula, and their properties are superior to that of foreign similar product, which is suitable for embedment of high power electronic component.
