绝缘材料
絕緣材料
절연재료
INSULATING MATERIALS
2014年
1期
17-21
,共5页
方庆玲%吴小龙%吴梅株%胡广群%徐杰栋
方慶玲%吳小龍%吳梅株%鬍廣群%徐傑棟
방경령%오소룡%오매주%호엄군%서걸동
高频%基材%介电常数%介质损耗%表面粗糙度
高頻%基材%介電常數%介質損耗%錶麵粗糙度
고빈%기재%개전상수%개질손모%표면조조도
high frequency%substrate materials%Dk%Df%surface roughness
概述了高频基材的发展现状，重点探讨了其选型原则，并介绍了高频印制板对基材的介电常数(Dk)、介质损耗因数（Df）、铜箔表面粗糙度等方面提出的特殊要求，最后分析了全球主要高频基材供应商的相关产品材料组成及其介电性能。
概述瞭高頻基材的髮展現狀，重點探討瞭其選型原則，併介紹瞭高頻印製闆對基材的介電常數(Dk)、介質損耗因數（Df）、銅箔錶麵粗糙度等方麵提齣的特殊要求，最後分析瞭全毬主要高頻基材供應商的相關產品材料組成及其介電性能。
개술료고빈기재적발전현상，중점탐토료기선형원칙，병개소료고빈인제판대기재적개전상수(Dk)、개질손모인수（Df）、동박표면조조도등방면제출적특수요구，최후분석료전구주요고빈기재공응상적상관산품재료조성급기개전성능。
The development situation of substrate materials for high frequency printed circuit board (PCB) was summarized, and the selection principle of substrate materials was mainly discussed. The special re-quirements of high frequency PCB on the dielectric loss(Dk), dielectric dissipation factor(Df) and surface roughness of copper foil of the substrate materials were introduced, and the material composition and di-electric properties of relative products from global main high frequency substrate materials supplier were analyzed.
