电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2012年
4期
1-6,12
,共7页
封装工艺%减薄机%键合机%倒装
封裝工藝%減薄機%鍵閤機%倒裝
봉장공예%감박궤%건합궤%도장
Packaging process%Back grinder%Wire bonder%Flip chip
随着信息技术的发展,集成电路封装工艺技术发展为先进封装技术。先进封装关键工艺设备作为实现先进封装工艺的基础和保证,已经成为制约半导体工业发展的瓶颈之一,面临良好的机遇和严峻的挑战。
隨著信息技術的髮展,集成電路封裝工藝技術髮展為先進封裝技術。先進封裝關鍵工藝設備作為實現先進封裝工藝的基礎和保證,已經成為製約半導體工業髮展的瓶頸之一,麵臨良好的機遇和嚴峻的挑戰。
수착신식기술적발전,집성전로봉장공예기술발전위선진봉장기술。선진봉장관건공예설비작위실현선진봉장공예적기출화보증,이경성위제약반도체공업발전적병경지일,면림량호적궤우화엄준적도전。
With the development of information technology,advanced packaging technologies are growing as the main stream of the IC packaging process.As the basis and guarantee of the advanced packaging process,key advanced packaging equipments has become a bottleneck for the development of the semiconductor industry,which is opening up severe challenges and fantastic opportunities.
