电子质量
電子質量
전자질량
ELECTRONICS QUALITY
2014年
4期
24-28
,共5页
Cu pad%焊点可靠性%有限元%BGA
Cu pad%銲點可靠性%有限元%BGA
Cu pad%한점가고성%유한원%BGA
Cu pad%Solder Joint Reliability%finite element%BGA
随着集成电路封装技术的发展，器件焊点可靠性成为国内外研究的重点，该文介绍了影响BGA焊点可靠性的常见因素，并以一块电路板为例，构建带有焊点亚结构---Cu pad和无Cu pad的两种电路板模型，仿真分析热循环条件下Cu pad对焊点可靠性的影响，为整板简化建模提供参考意见。
隨著集成電路封裝技術的髮展，器件銲點可靠性成為國內外研究的重點，該文介紹瞭影響BGA銲點可靠性的常見因素，併以一塊電路闆為例，構建帶有銲點亞結構---Cu pad和無Cu pad的兩種電路闆模型，倣真分析熱循環條件下Cu pad對銲點可靠性的影響，為整闆簡化建模提供參攷意見。
수착집성전로봉장기술적발전，기건한점가고성성위국내외연구적중점，해문개소료영향BGA한점가고성적상견인소，병이일괴전로판위례，구건대유한점아결구---Cu pad화무Cu pad적량충전로판모형，방진분석열순배조건하Cu pad대한점가고성적영향，위정판간화건모제공삼고의견。
Along with the development of the integrated circuit packaging technology,solder joint reliability become the focus of the research in the domestic and overseas,this paper introduces the common factors effecting the reliability of BGA solder joint,and we take a circuit board as a case,building two kinds of circuit board,one with solder joint substructure Cu pad,another without Cu pad.The influence of Cu pad on the sol-der joints reliability are analyzed through the simulation under thermal cycling conditions,provide reference for the simplified model of the whole board.
