CAJ | 학술논문

以未拆和已拆电子元器件的废旧印刷线路板（Waste Printed Circuit Boards,WPCBs）为研究对象,对比研究了其在硝酸中金属铜的浸出规律。研究结果表明：两者铜的浸出率随粒径的增大、时间的延长和固液比的减小而增大,温度对两者的影响都不大。已拆电子元器件的WPCBs的铜浸出率随H2O2和HNO3用量的增大而增大,而后者在实验讨论的范围内,H2O2和HNO3用量对其浸出率无明显影响。对于1 g样品,当未拆电子元器件的WPCBs粒径为0.25～0.5 mm,固液比为1：1,H2O2和HNO3均为2 mL时,50℃浸出2 h,即可浸出几乎全部的铜;当已拆电子元器件的WPCBs粒径为0.1～0.25 mm,固液比为1：1,H2O2和HNO3用量分别为2 mL和6 mL时,室温浸出2 h,铜浸出率达92.03%。
이미탁화이탁전자원기건적폐구인쇄선로판（Waste Printed Circuit Boards,WPCBs）위연구대상,대비연구료기재초산중금속동적침출규률。연구결과표명：량자동적침출솔수립경적증대、시간적연장화고액비적감소이증대,온도대량자적영향도불대。이탁전자원기건적WPCBs적동침출솔수H2O2화HNO3용량적증대이증대,이후자재실험토론적범위내,H2O2화HNO3용량대기침출솔무명현영향。대우1 g양품,당미탁전자원기건적WPCBs립경위0.25～0.5 mm,고액비위1：1,H2O2화HNO3균위2 mL시,50℃침출2 h,즉가침출궤호전부적동;당이탁전자원기건적WPCBs립경위0.1～0.25 mm,고액비위1：1,H2O2화HNO3용량분별위2 mL화6 mL시,실온침출2 h,동침출솔체92.03%。
A comparative research was carried out onleaching copper from waste printed circuit boards(WPCBs) mounted/unmounted with electronic components.The results show that copper leaching ratesin the two systems increase with the increase of particle size and leaching time and decrease with the increase of solid-liquid ratio,and the temperature does not significantly affect the leaching rates.Cu leaching rate increases with the increase of nitric acid or hydrogen peroxide dosage for WPCBs unmounted with electronic components.While for WPCBs mounted with electronic components,the dosage of nitric acid or hydrogen peroxide shows little effect in this experiment system.When particle size of WPCBs mounted with electronic components is 0.25-0.5 mm,solid-liquid ratio is 1:1,both the dosage of nitric acid and hydrogen peroxide are 2 mL,leaching temperature and time are 50 ℃ and 2 h,almost all the copper is recovered.While the leaching rate is 92.03% when leaching copper from WPCBs unmounted with electronic components,particle size is 0.25~0.5 mm,solid-liquid ratio is 1:1,the dosage of nitric acid and hydrogen peroxidewere 2 mL and 6 mL,leaching temperature is 20 ℃and leaching time is 2 h.