CAJ | 학술논문

应用热分析技术,能够在产品设计阶段获得其温度分布,从而优化设计,提高产品的可靠性,延长其使用寿命。该文以19吋2U电子产品的热设计为例,介绍了用Ansys软件的热分析功能进行辅助热分析的数值方法和热分析软件的特点,通过仿真分析,预测产品内部的热量分布和气流分布情况,并把仿真结果与实验值进行了比较,验证了方法的正确性。根据分析结果优化相应的设计参数,合理调整设计布局,可以找到最佳的设计方案。阐述了Ansys仿真技术的特点和一般应用方法。
응용열분석기술,능구재산품설계계단획득기온도분포,종이우화설계,제고산품적가고성,연장기사용수명。해문이19두2U전자산품적열설계위례,개소료용Ansys연건적열분석공능진행보조열분석적수치방법화열분석연건적특점,통과방진분석,예측산품내부적열량분포화기류분포정황,병파방진결과여실험치진행료비교,험증료방법적정학성。근거분석결과우화상응적설계삼수,합리조정설계포국,가이조도최가적설계방안。천술료Ansys방진기술적특점화일반응용방법。
Application of thermal analysis technology to the product design stage to obtain the temperature distribution,in order to optimize design and improve the reliability of new products,extending its life.In this paper,take the design of 19 inches 2U electronic products for example,describes the thermal analysis using Ansys software supporting functions of numerical methods of thermal analysis and thermal analysis software features,forecasting new product within the distribution of heat distribution and airflow by using simulation analysis and the simulation results are compared with experiments to verify the correctness of the method.Based on the results corresponding to optimize the design parameters,a reasonable adjustment design layout,you can find the best design.And described the general characteristics and application methods about Ansys simulation.