CAJ | 학술논문

晶片的洁净程度直接决定了晶片的价值，而晶片最前端工艺就是清洗。现代化超声技术的应用可让晶片更洁净。超声波清洗的功率、频率、尺寸、安装方式的选择都与晶片清洁程度有着密切关系。主要对超声波的原理和频率的选定进行了介绍。
정편적길정정도직접결정료정편적개치，이정편최전단공예취시청세。현대화초성기술적응용가양정편경길정。초성파청세적공솔、빈솔、척촌、안장방식적선택도여정편청길정도유착밀절관계。주요대초성파적원리화빈솔적선정진행료개소。
Wafer clean degree directly determines the value of. While the front end is the cleaning wafer process. Let the wafer cleaning cleaner, has been engaged in cleaning industry personnel problem. Modem ultrasound technology applications for this problem has been solved very well. Ultrasonic cleaning power, frequency, size, installation mode choice and wafer cleaning degree is closely related to. Mainly on the principle of ultrasonic wave and frequency selection are introduced.