高电压技术
高電壓技術
고전압기술
HIGH VOLTAGE ENGINEERING
2012年
7期
1731-1735
,共5页
桑利军%赵桥桥%胡朝丽%李兴存%雷雯雯%陈强
桑利軍%趙橋橋%鬍朝麗%李興存%雷雯雯%陳彊
상리군%조교교%호조려%리흥존%뢰문문%진강
电子回旋共振等离子体%三甲基铝(TMA)%原子层沉积%表面形貌%氧化铝%沉积速率
電子迴鏇共振等離子體%三甲基鋁(TMA)%原子層沉積%錶麵形貌%氧化鋁%沉積速率
전자회선공진등리자체%삼갑기려(TMA)%원자층침적%표면형모%양화려%침적속솔
electron cyclotron resonance plasma%trimethylaluminum(TMA)%atomic layer deposition%surfacetopography%AlcOa%deposition rate
为在室温条件下进行氧化铝薄膜的原子层沉积,自行设计了一套微波回旋共振等离子体辅助原子层沉积装置,以三甲基铝作为铝源前躯体,氧气作为氧化剂,在室温下于氢氟酸溶液中处理过的单晶硅基片上进行了氧化铝薄膜的沉积。利用扫描电子显微镜、原子力显微镜、高分辨率透射电子显微镜、X-ray射线衍射、X-ray射线光电子能谱等分析手段测试了薄膜的表面形貌和成分,结果表明制备的氧化铝薄膜为非晶态结构,铝、氧元素含量配比接近2/3,同时薄膜表面非常光滑平整而且致密,表面粗糙度<0.4nm。通过高分辨率透射电子显微镜的截面图,可以估算出薄膜厚度约为80nm,界面非常清晰、平整,薄膜质量较高,沉积速率为0.27nm/周期,沉积速率较热沉积大大提高。
為在室溫條件下進行氧化鋁薄膜的原子層沉積,自行設計瞭一套微波迴鏇共振等離子體輔助原子層沉積裝置,以三甲基鋁作為鋁源前軀體,氧氣作為氧化劑,在室溫下于氫氟痠溶液中處理過的單晶硅基片上進行瞭氧化鋁薄膜的沉積。利用掃描電子顯微鏡、原子力顯微鏡、高分辨率透射電子顯微鏡、X-ray射線衍射、X-ray射線光電子能譜等分析手段測試瞭薄膜的錶麵形貌和成分,結果錶明製備的氧化鋁薄膜為非晶態結構,鋁、氧元素含量配比接近2/3,同時薄膜錶麵非常光滑平整而且緻密,錶麵粗糙度<0.4nm。通過高分辨率透射電子顯微鏡的截麵圖,可以估算齣薄膜厚度約為80nm,界麵非常清晰、平整,薄膜質量較高,沉積速率為0.27nm/週期,沉積速率較熱沉積大大提高。
위재실온조건하진행양화려박막적원자층침적,자행설계료일투미파회선공진등리자체보조원자층침적장치,이삼갑기려작위려원전구체,양기작위양화제,재실온하우경불산용액중처리과적단정규기편상진행료양화려박막적침적。이용소묘전자현미경、원자력현미경、고분변솔투사전자현미경、X-ray사선연사、X-ray사선광전자능보등분석수단측시료박막적표면형모화성분,결과표명제비적양화려박막위비정태결구,려、양원소함량배비접근2/3,동시박막표면비상광활평정이차치밀,표면조조도<0.4nm。통과고분변솔투사전자현미경적절면도,가이고산출박막후도약위80nm,계면비상청석、평정,박막질량교고,침적속솔위0.27nm/주기,침적속솔교열침적대대제고。
In order to achieve atomic layer deposition of alumina thin films at room temperature, taking trimethylaluminum (TMA) as the precursor and oxygen as the oxidant, respectively , we used an atomic layer deposition(PA-ALD) setup of homemade electron cyclotron resonance (ECR) assisted with plasma to deposit AI203 thin film on the single crystal silicon surface at room temperature. Through scanning electron microscope (SEM), atomic force microscope, high resolution transmission electron microscope, X-ray diffraction and X-ray photoelectric spectroscopy, the surface topography and composition of the as-deposited films were tested. It is found that the A12 03 films are amorphous, and the atomic ratio of aluminum to oxygen is close to 2/3. The film surface is very smooth and the roughness is smaller than 0.4 nm. The cross-sectional images show that the film thickness is 80 nm with specially clear and smooth interface, better film quality, and the deposition rate is 0.27 nm in one cycle, which is much larger than the thermal ALD.