印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
z1期
410-418
,共9页
阶梯板%凹陷%覆型方式%贴膜
階梯闆%凹陷%覆型方式%貼膜
계제판%요함%복형방식%첩막
Cavity Board%Depressed%Conforming Way%Dry Film Laminate
具有阶梯结构的PCB板通常采用No-flow PP片铣槽开窗的方式生产。由于此工艺在开窗区存在高度落差,在压合后开窗区的板面易产生凹陷,影响后续流程的制作,如树脂塞孔、外层线路等。本文通过对覆型方式、层间PP数量对板面凹陷的影响进行研究,在满足填胶前提下,有效地将凹陷降低至60mm以下,满足一次贴膜无缺陷。同时针对真空塞孔流程,采用贴膜→塞孔→打磨→去膜的工艺,解决了塞孔后凹陷处的树脂无法打磨掉的缺陷问题,为阶梯结构的PCB板面品质的提升提供新的思路。
具有階梯結構的PCB闆通常採用No-flow PP片鐉槽開窗的方式生產。由于此工藝在開窗區存在高度落差,在壓閤後開窗區的闆麵易產生凹陷,影響後續流程的製作,如樹脂塞孔、外層線路等。本文通過對覆型方式、層間PP數量對闆麵凹陷的影響進行研究,在滿足填膠前提下,有效地將凹陷降低至60mm以下,滿足一次貼膜無缺陷。同時針對真空塞孔流程,採用貼膜→塞孔→打磨→去膜的工藝,解決瞭塞孔後凹陷處的樹脂無法打磨掉的缺陷問題,為階梯結構的PCB闆麵品質的提升提供新的思路。
구유계제결구적PCB판통상채용No-flow PP편선조개창적방식생산。유우차공예재개창구존재고도락차,재압합후개창구적판면역산생요함,영향후속류정적제작,여수지새공、외층선로등。본문통과대복형방식、층간PP수량대판면요함적영향진행연구,재만족전효전제하,유효지장요함강저지60mm이하,만족일차첩막무결함。동시침대진공새공류정,채용첩막→새공→타마→거막적공예,해결료새공후요함처적수지무법타마도적결함문제,위계제결구적PCB판면품질적제승제공신적사로。
PCB board has a cavity structure usually No-flow PP adhesive sheet produced in a manner milling windows. Because this process window area gap exists in the windows after lamination plate surface area produces depression, affects the subsequent production processes, such as resin plug hole, the outer lines. The paper mainly studies cover type, the number of inter-layer PP comparative analysis on the impact of depression, obtains a better way to improve. At the same time, there is still depressed defect by the paste remained after dry grinding process of iflling of the resin solution, after the plug hole resin remaining in the depression out of the defects which can not be polished, the stepped structure of the PCB board recess provides effective guidance.