CAJ | 학술논문

主要对化学镍钯金表面处理工艺原理进行介绍，通过挠性电路板化学镍钯金后引线健合能力、可焊性、抗老化等一系列可靠性测试，验证其相对其它表面处理技术更加优越，特别适用于表面贴装混合组装板等要求高连接可靠性的产品上，并且满足无铅组装工艺所有需求，非常适合挠性板、封装基板等的表面处理PCB制造。
주요대화학얼파금표면처리공예원리진행개소，통과뇨성전로판화학얼파금후인선건합능력、가한성、항노화등일계렬가고성측시，험증기상대기타표면처리기술경가우월，특별괄용우표면첩장혼합조장판등요구고련접가고성적산품상，병차만족무연조장공예소유수구，비상괄합뇨성판、봉장기판등적표면처리PCB제조。
This article mainly introduced the reference process principle of ENEPIG surface treatment technology, through the FPC board after ENEPIG bonding ability, weldability, aging resistance and a series of reliability test, veriifcation of its more superior than other surface treatment technology, especially suitable for SMT mixed assembling plate for high connection reliability of products, and meet the demand of all lead free assembly process, very suitable for FPC board, packing substrate surface treatment of PCB manufacturing.