CAJ | 학술논문

文章简要概述了埋盲孔板在电镀加工时，通盲孔不同厚径比的TP值、以及多次压合带来铜厚均匀性所引起孔壁可靠性及线条均匀性问题。通过从流程分解，分别从树脂塞孔工艺、减铜工艺、酸碱蚀工艺对比、电镀工艺等影响因素进行分析研究，提出了在通盲孔同步电镀工艺中，改善孔壁可靠性和线条均匀性的有效方法。
문장간요개술료매맹공판재전도가공시，통맹공불동후경비적TP치、이급다차압합대래동후균균성소인기공벽가고성급선조균균성문제。통과종류정분해，분별종수지새공공예、감동공예、산감식공예대비、전도공예등영향인소진행분석연구，제출료재통맹공동보전도공예중，개선공벽가고성화선조균균성적유효방법。
This article describes a brief overview of the hole reliability and line uniformity caused by multiple lamination and the TP value of different aspect ratio. Through decomposing the process and analyzing the inlfuencing factors like resin-plugging process, copper reduction process, contrast of acid and alkali etch process, plating process, etc, we put forward a effective method of improving the hole availability and the uniformity of lines in the plating process where the via hole and blind hole is synchronous.