印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
z1期
300-303
,共4页
黄勇%吴会兰%苏新虹
黃勇%吳會蘭%囌新虹
황용%오회란%소신홍
高密度互连%介质材料%薄型化技术%玻璃纤维布%阻抗%翘曲
高密度互連%介質材料%薄型化技術%玻璃纖維佈%阻抗%翹麯
고밀도호련%개질재료%박형화기술%파리섬유포%조항%교곡
High Density Interconnecting%Dielectric Material%Thinning Technology%Glass Fiber Cloth%Impedance%Warping
高密度互连电路板不断趋于薄型化。文章介绍了高密度互连电路板所用介质材料薄层化发展状态，并对薄型化加工中的关键技术问题进行了探讨。
高密度互連電路闆不斷趨于薄型化。文章介紹瞭高密度互連電路闆所用介質材料薄層化髮展狀態，併對薄型化加工中的關鍵技術問題進行瞭探討。
고밀도호련전로판불단추우박형화。문장개소료고밀도호련전로판소용개질재료박층화발전상태，병대박형화가공중적관건기술문제진행료탐토。
The high density interconnecting printed circuit board is becoming thinner and thinner. In this paper the thinning technology development status of dielectric material used in high density interconnecting printed circuit board was introduced, and the key technical issues in the thinning processing were discussed.
