CAJ | 학술논문

文章对高阶（3阶和4阶）HDI板的各项对位进行了理论分析，并对其实验验证了对位能力、可靠性、剥离强度等性能，为高阶HDI板的设计、制作提供参考。结果表明，特定的对位方式下，不同位置的盲孔与其底部焊盘的对位存在较大差异；通过理论对位分析和实验验证，可确定“盲孔与盲孔”最佳对位方式；此外，常规板材的高阶HDI板多次压合后，其可靠性、剥离强度等性能表现良好、满足生产要求。
문장대고계（3계화4계）HDI판적각항대위진행료이론분석，병대기실험험증료대위능력、가고성、박리강도등성능，위고계HDI판적설계、제작제공삼고。결과표명，특정적대위방식하，불동위치적맹공여기저부한반적대위존재교대차이；통과이론대위분석화실험험증，가학정“맹공여맹공”최가대위방식；차외，상규판재적고계HDI판다차압합후，기가고성、박리강도등성능표현량호、만족생산요구。
To provide reference for the design and manufacture of multi-Step(3 step and 4step) Via HDI board, a theoretic analysis on the various registration and experimental veriifcation of reliability capacity, peel strength is developed in the paper. Theories are compared with experimental data obtained over previous experiments. Results show that in speciifc positioning mode, the different positions of the blind Via with its Target Pad on the registration is a larger difference;By analysis and experimental veriifcation, the best positioning of registration for blind Via to blind Via is determined;In addition, the multi-Step Via HDI board laminated by conventional materials repeatedly have a good performance of its reliability, peel strength, etc to meet production requirements.