CAJ | 학술논문

在封装基板生产过程中，电镀镍-金表面形貌对金属线键合的金属丝线拉力有着显著的影响。金面形貌取决于电镀镍面形貌，电镀镍结晶晶粒粗大、均匀，有利于提高金线与金面焊接有效面积，镍面粗糙度增大（Ra=0.33μm±0.02μm），能够有效提高金属线键合可靠性。通过改善基铜形貌、降低电流密度以及减少电镀镍光亮添加剂含量，改善电镀镍的结晶过程，使得晶核生长速度大于核形成速度，进而达到电镀镍结晶晶粒粗大、均匀。改善后金属线键合的金属丝线拉力可稳定在7 gf以上。
재봉장기판생산과정중，전도얼-금표면형모대금속선건합적금속사선랍력유착현저적영향。금면형모취결우전도얼면형모，전도얼결정정립조대、균균，유리우제고금선여금면한접유효면적，얼면조조도증대（Ra=0.33μm±0.02μm），능구유효제고금속선건합가고성。통과개선기동형모、강저전류밀도이급감소전도얼광량첨가제함량，개선전도얼적결정과정，사득정핵생장속도대우핵형성속도，진이체도전도얼결정정립조대、균균。개선후금속선건합적금속사선랍력가은정재7 gf이상。
During the course of package substrate production, the surface topography of Au/Ni plating has signiifcant inlfuence on the wire bonding wire pull. The Gold surface morphology depends on the crystallization process of Ni plating. Electroplated nickel crystal coarse grain, uniform, is favorable for improving the contact area. The nickel surface roughness increase can effectively improve the reliability of wire bonding. Through the improvement of copper morphology, lower current density and reduced nickel plating brightener content, improvement crystallization process of nickel plating, the crystal nucleus growth velocity is larger than the nucleation, achieve the electroplating nickel crystal coarse grain and uniform. The will pull steadily above 7gf before improved.