CAJ | 학술논문

通过对模拟回流焊锡膏扩展实验，还原了PCB润湿焊接的细节。并结合不同表面处理在不同温度条件下的润湿天平测试，对比了不同表面处理在不同温度条件下的润湿平衡曲线走势及其润湿性能变化，从润湿过程角度解析了不同润湿平衡曲线的物理化学意义，深化了对润湿过程的理解，为快速定位可焊性不良问题提供了分析思路及依据。
통과대모의회류한석고확전실험，환원료PCB윤습한접적세절。병결합불동표면처리재불동온도조건하적윤습천평측시，대비료불동표면처리재불동온도조건하적윤습평형곡선주세급기윤습성능변화，종윤습과정각도해석료불동윤습평형곡선적물이화학의의，심화료대윤습과정적리해，위쾌속정위가한성불량문제제공료분석사로급의거。
In this paper, based on the solder paste spreading experiment, wetting details during PCB welding procedure were described. By using the wetting balance methods, the shapes of wetting balance curves and the wettability changes of different ifnishes under different temperatures were contrastively analyzed, the physical and chemical signiifcances of different wetting balance curves were discussed from the perspective of the wetting process, the understanding of the wetting process was deepen and ideas and basis were provided for the quickly problem locating in the poor solderability analysis.