印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
z1期
209-216
,共8页
沉金%镍腐蚀%无铅化
沉金%鎳腐蝕%無鉛化
침금%얼부식%무연화
ENIG%Nickel Corrosion%Leadfree
随着无铅化产业的推进,沉金工艺作为无铅适应性的一种表面处理,由于其各种优点的存在,已愈来愈为更多的SMT厂家乃至终端客户所倚重。也正是由于无铅产业的切换,客户端对于可靠性提出了高要求,而镍腐蚀问题与沉金似乎如影随行,在近些年来引起广泛重视。笔者在前文中针对此课题也做一些研究,主要针对镍槽相关控制参数对镍腐蚀的影响做深入探讨。然而镍腐蚀问题不仅受镍槽影响,其与金槽相关控制要素也紧密相关,笔者在本章中依旧结合生产实际出发,根据实验测试,对影响镍腐蚀的关键因素做一些深入而独特的探讨,分析其内在机理,以期能够帮助到生产实际,为业内同行提升沉金工艺品质提供切实有效的参考。
隨著無鉛化產業的推進,沉金工藝作為無鉛適應性的一種錶麵處理,由于其各種優點的存在,已愈來愈為更多的SMT廠傢迺至終耑客戶所倚重。也正是由于無鉛產業的切換,客戶耑對于可靠性提齣瞭高要求,而鎳腐蝕問題與沉金似乎如影隨行,在近些年來引起廣汎重視。筆者在前文中針對此課題也做一些研究,主要針對鎳槽相關控製參數對鎳腐蝕的影響做深入探討。然而鎳腐蝕問題不僅受鎳槽影響,其與金槽相關控製要素也緊密相關,筆者在本章中依舊結閤生產實際齣髮,根據實驗測試,對影響鎳腐蝕的關鍵因素做一些深入而獨特的探討,分析其內在機理,以期能夠幫助到生產實際,為業內同行提升沉金工藝品質提供切實有效的參攷。
수착무연화산업적추진,침금공예작위무연괄응성적일충표면처리,유우기각충우점적존재,이유래유위경다적SMT엄가내지종단객호소의중。야정시유우무연산업적절환,객호단대우가고성제출료고요구,이얼부식문제여침금사호여영수행,재근사년래인기엄범중시。필자재전문중침대차과제야주일사연구,주요침대얼조상관공제삼수대얼부식적영향주심입탐토。연이얼부식문제불부수얼조영향,기여금조상관공제요소야긴밀상관,필자재본장중의구결합생산실제출발,근거실험측시,대영향얼부식적관건인소주일사심입이독특적탐토,분석기내재궤리,이기능구방조도생산실제,위업내동행제승침금공예품질제공절실유효적삼고。
In recently years, lead-free PCB surface treatment processes were more and more popular in electrical industrial. As one of the lead-free PCB surface treatment process, the electroless nickel/immersion gold(ENIG) was valued by more SMT manufacturers and even end customers because of its advantage. It is due to the exchange, the client had put forward higher requirements of the reliability of the products. But the nickel corrosion was a problem that can’t be solved for a long time for ENIG. In the previous the author had done some research for this topic and the effect of control parameters of Nickel slot on discoloration problems was discussed in that paper . However the nickel corrosion problem is not only inlfuenced by the nickel tank, and is also closely related to the associated control elements with gold tank. The factor of effect on nickel erode was still discussed in this paper by means of some experiments connected to manufacture from the angle of the control of the gold ifligree, and it was hope to be the technology support to improve the quality of ENIG and provide effective reference to enhance the quality of ENIG.