印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
z1期
156-161
,共6页
单组分添加剂副产物%恒电流法%电镀填孔%作用机理模型
單組分添加劑副產物%恆電流法%電鍍填孔%作用機理模型
단조분첨가제부산물%항전류법%전도전공%작용궤리모형
Single-Component By-Products of Additives%Constant Current Method%Microvia Filling%Mechanism Model
文章制备了单组份添加剂副产物，并采用恒电流法，通过阴极电位变化值?φ与最大极化电位来表征单组份添加剂副产物，结合相应的电镀填孔试验，分析其对电镀填孔的影响，建立了添加剂副产物对电镀填孔的作用机理模型。
文章製備瞭單組份添加劑副產物，併採用恆電流法，通過陰極電位變化值?φ與最大極化電位來錶徵單組份添加劑副產物，結閤相應的電鍍填孔試驗，分析其對電鍍填孔的影響，建立瞭添加劑副產物對電鍍填孔的作用機理模型。
문장제비료단조빈첨가제부산물，병채용항전류법，통과음겁전위변화치?φ여최대겁화전위래표정단조빈첨가제부산물，결합상응적전도전공시험，분석기대전도전공적영향，건립료첨가제부산물대전도전공적작용궤리모형。
In the thesis, prepared single-component by-products of copper plating additives is discussed. The by-products of copper plating additives were characterized by constant current method, through the cathode potential change of?φand maximum polarization potential. Then it combined with the corresponding microvia iflling test, analyzed its impact on microvia iflling. Finally, the mechanism model of by-products of additives over microvia iflling was established.
