CAJ | 학술논문

随着电子产品的持续发展，HDI印制电路板的应用越来越广泛，本文通过正交实验优化电镀填孔工艺参数，并通过控制变量法研究了通孔孔径及位置对盲孔电镀填孔效果的影响，并以金相显微镜分析盲孔的凹陷度作为考察指标。研究结果表明采用优化参数能够降低盲孔填充凹陷度，通孔对盲孔的填孔电镀效果会产生影响，随着通孔孔径的增大，对盲孔的填孔电镀越有利，同时实验还发现，若在孔金属化后通孔孔壁与盲孔底部铜层电导通有利于盲孔的填孔。
수착전자산품적지속발전，HDI인제전로판적응용월래월엄범，본문통과정교실험우화전도전공공예삼수，병통과공제변량법연구료통공공경급위치대맹공전도전공효과적영향，병이금상현미경분석맹공적요함도작위고찰지표。연구결과표명채용우화삼수능구강저맹공전충요함도，통공대맹공적전공전도효과회산생영향，수착통공공경적증대，대맹공적전공전도월유리，동시실험환발현，약재공금속화후통공공벽여맹공저부동층전도통유리우맹공적전공。
With the electronic products continuous improvement, HDI has extensive application in PCB. In this paper, optimizing process parameters through orthogonal experiment was used for improving microvia-ifliing efifciency, and the effect of through-hole size and place on microvia-iflling plating had been study by control variable method, besides, the via iflling effect was proved by metallographic slicing test. Research results show that the microvia with lower dimple can be completed well by the optimum technology, and the dimple reduced while through-hole pere size increased, and it was beneifcial to microvia-iflling plating if through-hole and the bottom of microvia were conductive after hole metallization.