印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
z1期
32-38
,共7页
李丰%刘东%白亚旭%岑文峰
李豐%劉東%白亞旭%岑文峰
리봉%류동%백아욱%잠문봉
负片%全板电镀%极差%酸性蚀刻%蚀刻量
負片%全闆電鍍%極差%痠性蝕刻%蝕刻量
부편%전판전도%겁차%산성식각%식각량
Negative Film%Full Board Electroplating%Acid Etching%Etching Amount
负片表铜极差和铜厚过大,线路补偿不足,极易造成线路蚀刻不净及线幼,严重影响品质。文章通过探讨不同电镀时间、不同板尺寸时的电镀极差及不同铜厚时的蚀刻量的关系,从而找出不同线宽线距板生产和设计控制方法,减少上述品质风险。
負片錶銅極差和銅厚過大,線路補償不足,極易造成線路蝕刻不淨及線幼,嚴重影響品質。文章通過探討不同電鍍時間、不同闆呎吋時的電鍍極差及不同銅厚時的蝕刻量的關繫,從而找齣不同線寬線距闆生產和設計控製方法,減少上述品質風險。
부편표동겁차화동후과대,선로보상불족,겁역조성선로식각불정급선유,엄중영향품질。문장통과탐토불동전도시간、불동판척촌시적전도겁차급불동동후시적식각량적관계,종이조출불동선관선거판생산화설계공제방법,감소상술품질풍험。
Negative iflm surface copper range and copper thickness is too thick, line compensation is not enough, which is extremely easy to cause the line etching not clean and the line too thin, and seriously affects the quality. This paper discusses the different plating time, different plate size, the relationship between etching amount range and different plating copper thickness, to find out different line width from board design and production control method, to reduce the quality as said or narrated above.