印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
z1期
22-27
,共6页
覆铜箔层压板%热导率%内层厚铜%热膨胀系数%可靠性
覆銅箔層壓闆%熱導率%內層厚銅%熱膨脹繫數%可靠性
복동박층압판%열도솔%내층후동%열팽창계수%가고성
Copper Clad Laminate%Thermal Conductivity%Inner Heavy Copper%Coefficient of Thermal Expand%Reliability
电子产品的多功能化、薄型化要求PCB轻薄短小，电子元器件安装密度高，因此发热量大，为了保证电子元器件寿命及产品的可靠性，热管理显得越来越重要。基于以上应用需求，文章旨在介绍一种玻纤布增强导热覆铜箔层压板及其粘结片，该板材热导率比传统FR-4高3~5倍，加工性相对良好，如钻头磨损相对于多数同类产品较小，更低热膨胀系数（CTE），高可靠性，粘结片层压工艺与传统无铅FR-4兼容，满足无铅制程要求。
電子產品的多功能化、薄型化要求PCB輕薄短小，電子元器件安裝密度高，因此髮熱量大，為瞭保證電子元器件壽命及產品的可靠性，熱管理顯得越來越重要。基于以上應用需求，文章旨在介紹一種玻纖佈增彊導熱覆銅箔層壓闆及其粘結片，該闆材熱導率比傳統FR-4高3~5倍，加工性相對良好，如鑽頭磨損相對于多數同類產品較小，更低熱膨脹繫數（CTE），高可靠性，粘結片層壓工藝與傳統無鉛FR-4兼容，滿足無鉛製程要求。
전자산품적다공능화、박형화요구PCB경박단소，전자원기건안장밀도고，인차발열량대，위료보증전자원기건수명급산품적가고성，열관리현득월래월중요。기우이상응용수구，문장지재개소일충파섬포증강도열복동박층압판급기점결편，해판재열도솔비전통FR-4고3~5배，가공성상대량호，여찬두마손상대우다수동류산품교소，경저열팽창계수（CTE），고가고성，점결편층압공예여전통무연FR-4겸용，만족무연제정요구。
With the tendency of multifunction and thinning of electronic product, the requirement for PCB is better to be Light-Thin-Small-Short. The density of electronic component is increasing. Thus the more heat of electronic product occurs. To guarantee the electronic component’s life and the reliability of product, thermal management is considered more and more important. According to above requirement of application, this article mainly introduces a kind of glass ifber reinforced CCL which is higher 3~5 times than conventional FR-4 in thermal conductivity, relative good in PCB process, such as lower drilling loss than similar product, lower CTE, high reliability, compatible laminating process of conventional lead-free solder product, and meets the requirement of lead-free solder process.
