印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
z1期
6-10
,共5页
陈际达%刘又畅%李晓蔚%张胜涛%晏放雄%周强村%徐缓%陈世金%何为
陳際達%劉又暢%李曉蔚%張勝濤%晏放雄%週彊村%徐緩%陳世金%何為
진제체%류우창%리효위%장성도%안방웅%주강촌%서완%진세금%하위
覆铜板%印制电路板%半固化片%设备改进
覆銅闆%印製電路闆%半固化片%設備改進
복동판%인제전로판%반고화편%설비개진
Copper Clad Laminate%Printed Circuit Board%Prepreg%Equipment Improvement
覆铜板（CCL）作为印制电路板的重要原材料，其性能与质量直接制约着电子产品制造技术、电子安装技术的发展。为此，论文总结了本研发团队近期公开发表的覆铜板制造设备相关专利的创新内容及思路，以期对我国CCL制造业界有所借鉴和启发。
覆銅闆（CCL）作為印製電路闆的重要原材料，其性能與質量直接製約著電子產品製造技術、電子安裝技術的髮展。為此，論文總結瞭本研髮糰隊近期公開髮錶的覆銅闆製造設備相關專利的創新內容及思路，以期對我國CCL製造業界有所藉鑒和啟髮。
복동판（CCL）작위인제전로판적중요원재료，기성능여질량직접제약착전자산품제조기술、전자안장기술적발전。위차，논문총결료본연발단대근기공개발표적복동판제조설비상관전리적창신내용급사로，이기대아국CCL제조업계유소차감화계발。
Copper clad laminate is the fundamental materials of printed circuit board, which plays a pivotal role in manufacturing technology of electronic products as well as electronic installation technology. In order to share the ideas of innovation or improvement on copper clad laminate with other corporations, the patents related to equipments for copper clad laminate processing issued from our team recently are summarized, and the contents and ideas of those patents are analyzed and elaborated.
