CAJ | 학술논문

采用电镀方法制备铜?铋复合涂层。由于铋在铜中的溶解度极低，因此涂层具有两相混合结构。研究铜在铜?铋复合涂层中的晶体结构和晶格参数，测试涂层的力学性能，并与铜涂层进行了比较。结果表明，电镀参数对涂层的力学性能影响较大。在电流密度为50 mA/cm2，电镀时间为20 min时，铜涂层的硬度为HV50165，而铜?铋复合涂层的硬度提高到HV50250；铜?铋复合涂层的耐磨性也相应提高。
채용전도방법제비동?필복합도층。유우필재동중적용해도겁저，인차도층구유량상혼합결구。연구동재동?필복합도층중적정체결구화정격삼수，측시도층적역학성능，병여동도층진행료비교。결과표명，전도삼수대도층적역학성능영향교대。재전류밀도위50 mA/cm2，전도시간위20 min시，동도층적경도위HV50165，이동?필복합도층적경도제고도HV50250；동?필복합도층적내마성야상응제고。
Electroplating has been used to produce Cu?Bi coatings. The crystal structure and lattice parameters of Cu in Cu?Bi composite coating were measured and compared with Cu coating. The mechanical properties of the coatings were also studied. It was found that the deposition parameters have significant effect on the mechanical properties of the Cu?Bi coatings. The microhardness has been improved from HV50165 of Cu coating to HV50 250 of Cu?Bi composite coating prepared at 50 mA/cm2 for 20 min. Correspondingly, wear resistance of the Cu?Bi composite coating has also been enhanced significantly.