印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
10期
63-66
,共4页
徐浩平%薛杉%胡宁
徐浩平%薛杉%鬍寧
서호평%설삼%호저
铜基微带板%镀金%盲孔%孔金属化工艺
銅基微帶闆%鍍金%盲孔%孔金屬化工藝
동기미대판%도금%맹공%공금속화공예
Copper Based Microstrip Plate%Gold-Plating%Blind Hole%Hole Metallization Technology
文章对金属基微带板材料性能进行了简单介绍，对铜基微带板的工艺流程及技术进行了详细说明。
文章對金屬基微帶闆材料性能進行瞭簡單介紹，對銅基微帶闆的工藝流程及技術進行瞭詳細說明。
문장대금속기미대판재료성능진행료간단개소，대동기미대판적공예류정급기술진행료상세설명。
In this paper, the material properties of the metal based microstrip plate are introduced and the process and technology of copper based microstrip plate are described in detail.
