印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
10期
29-32,70
,共5页
印制电路板%细密线路%外层良率%渗镀%铜丝
印製電路闆%細密線路%外層良率%滲鍍%銅絲
인제전로판%세밀선로%외층량솔%삼도%동사
PCB%Fine and Dense Line%Outer Layer Yield%Diffusion Coating%Copper Wire
电路板高密度化倾向，使得细、密线路板成为业界广泛的发展方向，而线路等级75μm/75μm甚至更细密之线路板，已在多家PCB制造商批量生产。然而，由于外层前处理参数、方法、物料管控不当产生的外层良率降低及报废飙升，令众多业者痛心疾首，望板兴叹。本文通过对与外层前处理相关的案例进行解析及探讨，希望为同行业者带来有参考价值的资料。
電路闆高密度化傾嚮，使得細、密線路闆成為業界廣汎的髮展方嚮，而線路等級75μm/75μm甚至更細密之線路闆，已在多傢PCB製造商批量生產。然而，由于外層前處理參數、方法、物料管控不噹產生的外層良率降低及報廢飆升，令衆多業者痛心疾首，望闆興歎。本文通過對與外層前處理相關的案例進行解析及探討，希望為同行業者帶來有參攷價值的資料。
전로판고밀도화경향，사득세、밀선로판성위업계엄범적발전방향，이선로등급75μm/75μm심지경세밀지선로판，이재다가PCB제조상비량생산。연이，유우외층전처리삼수、방법、물료관공불당산생적외층량솔강저급보폐표승，령음다업자통심질수，망판흥우。본문통과대여외층전처리상관적안례진행해석급탐토，희망위동행업자대래유삼고개치적자료。
High-density tendency of printed circuit boards has made the boards with ifner and denser circuits widely-accepted in the industry. Boards with line width and spacing of 75μm/75μm or even smaller than that, have been massively produced in many PCB manufacturers. However, the decreasing of out-layer yield and the soaring of scrap rate due to the improper controlling of the parameters, methods and materials in out-layer pretreatment process, has frustrated many manufacturers. This paper, through the analysis and discussion of the cases related to the out-layer pretreatment, is intended to bring the manufacturers with useful information for their reference.
