印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2013年
10期
15-19
,共5页
不流动%低流动%半固化片%连接
不流動%低流動%半固化片%連接
불류동%저류동%반고화편%련접
No-Flow%Low-Flow%Prepreg%Connection
随着刚挠板、阶梯板与金属基散热板需求量的增大，作为连接材料的不流动半固化的使用量增多。不流动半固化片与普通FR-4半固化片、纯胶片有很大的差别，本文结合实验验证，详细分析了不流动半固化片的测试指标、流动性等特性，为不流动半固化片的加工提供了若干建议。
隨著剛撓闆、階梯闆與金屬基散熱闆需求量的增大，作為連接材料的不流動半固化的使用量增多。不流動半固化片與普通FR-4半固化片、純膠片有很大的差彆，本文結閤實驗驗證，詳細分析瞭不流動半固化片的測試指標、流動性等特性，為不流動半固化片的加工提供瞭若榦建議。
수착강뇨판、계제판여금속기산열판수구량적증대，작위련접재료적불류동반고화적사용량증다。불류동반고화편여보통FR-4반고화편、순효편유흔대적차별，본문결합실험험증，상세분석료불류동반고화편적측시지표、류동성등특성，위불류동반고화편적가공제공료약간건의。
As rigid-lfexible board and metal base plate demand increased, the usage of No-Flow prepreg increased. No-Flow prepreg is very different with normal FR-4 and bonding sheet. Combining with the experimental veriifcation, this article analyzes the features of No-Flow prepreg in detail, such as test indicators, liquidity, etc. And give several effective suggestions in No-Flow prepreg processing.
