CAJ | 학술논문

论述了通过采取手工清洗和机器半水清洗的方式,对军用印制板组装件进行清洗,以使其能满足清洗后清洁度的要求和使用性能。结果表明：使用VIGON EFM清洗剂浸泡后手工刷洗的方式,以及使用清洗机配合PM102清洗剂的半水清洗方式,可以有效去除印制板上的助焊剂残留物,清洗后的离子污染度分别达到0.86μg（Nacl）/cm2和0.58μg（Nacl）/cm2,符合GJB 5807对三级电子产品离子污染度≤1.56μg（Nacl）/cm2的清洁度判定要求。
논술료통과채취수공청세화궤기반수청세적방식,대군용인제판조장건진행청세,이사기능만족청세후청길도적요구화사용성능。결과표명：사용VIGON EFM청세제침포후수공쇄세적방식,이급사용청세궤배합PM102청세제적반수청세방식,가이유효거제인제판상적조한제잔류물,청세후적리자오염도분별체도0.86μg（Nacl）/cm2화0.58μg（Nacl）/cm2,부합GJB 5807대삼급전자산품리자오염도≤1.56μg（Nacl）/cm2적청길도판정요구。
Discuss using hand-cleaning and semi-aqueous cleaning to wash military PCB for satisfying the requirement of cleanliness and capability. It is indicated that hand-cleaning by solvent o{ VIGON EFM and semi-aqueous cleaning by solvent of PM102 can wipe off left- over efficiently. Concentration inspection can up to 0.86 μg（Nacl）/cm2 and 0.58 μg（Nacl）/ cm2. It measures up GJB 5 807 which ion concentration inspection determinant is less than 1.56 μg（Nacl）/cm2 for the third class electronic product.