电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2012年
6期
31-34
,共4页
洪颖%冯玢%王磊%吴华%郭俊敏%杜萍
洪穎%馮玢%王磊%吳華%郭俊敏%杜萍
홍영%풍분%왕뢰%오화%곽준민%두평
SiC%电阻率%均匀性%COREMA%SIMS
SiC%電阻率%均勻性%COREMA%SIMS
SiC%전조솔%균균성%COREMA%SIMS
Silicon carbide%Resistivity%Uniformity%COREMA%SIMS
在采用COREMA方法测试SiC晶片电阻率时发现同一晶片电阻率相差较大.主要体现在高阻(〉10^5Ω·cm量级)和低阻(〈10^5量级)并存,有的甚至超高阻(〉10^12量级)和低阻并存,针对这一测试结果,开展了相关的实验研究,SiC单晶半绝缘性能的实现是通过在单晶生长过程中掺入深能级杂质V来补偿浅施主N和浅受主B,利用二次质谱(SIMS)对同一晶片不同区域的杂质元素V、N和B含量进行测试,结果发现晶片中v和N的含量都在1×10^17量级时会出现同一晶片不同区域电阻率相差较大的情况,而当V含量在1×10^17量级,N含量在5×10^16量级以下时,可制备电阻率均匀性好的半绝缘SiC单晶。
在採用COREMA方法測試SiC晶片電阻率時髮現同一晶片電阻率相差較大.主要體現在高阻(〉10^5Ω·cm量級)和低阻(〈10^5量級)併存,有的甚至超高阻(〉10^12量級)和低阻併存,針對這一測試結果,開展瞭相關的實驗研究,SiC單晶半絕緣性能的實現是通過在單晶生長過程中摻入深能級雜質V來補償淺施主N和淺受主B,利用二次質譜(SIMS)對同一晶片不同區域的雜質元素V、N和B含量進行測試,結果髮現晶片中v和N的含量都在1×10^17量級時會齣現同一晶片不同區域電阻率相差較大的情況,而噹V含量在1×10^17量級,N含量在5×10^16量級以下時,可製備電阻率均勻性好的半絕緣SiC單晶。
재채용COREMA방법측시SiC정편전조솔시발현동일정편전조솔상차교대.주요체현재고조(〉10^5Ω·cm량급)화저조(〈10^5량급)병존,유적심지초고조(〉10^12량급)화저조병존,침대저일측시결과,개전료상관적실험연구,SiC단정반절연성능적실현시통과재단정생장과정중참입심능급잡질V래보상천시주N화천수주B,이용이차질보(SIMS)대동일정편불동구역적잡질원소V、N화B함량진행측시,결과발현정편중v화N적함량도재1×10^17량급시회출현동일정편불동구역전조솔상차교대적정황,이당V함량재1×10^17량급,N함량재5×10^16량급이하시,가제비전조솔균균성호적반절연SiC단정。
We found that the resistivity of SiC varies widely in the same wafer with different areas during measured by SemiMap COREMA-WT (contactless resistivity mapping) , the values may be below 1× 10^5 1Ω·cm, between 1 × 10^5 -1×1012 Ω·cm, and over 1 × 10^12 Ω·cm. As we know, the vanadium act as deep acceptor to compensate all donor nitrogen and boron impurity, then SI-SiC can be obtained. Secondary ion mass spectroscopy (SIMS) was used to determine the impurities of boron, nitrogen and vanadium which play an important role in terms of resistivity. As a result, when the concentration of the vanadium and nitrogen was 1 × 10^17 cm^3, the resistivity of the wafer with different areas may be vary widely, but when the concentration of the vanadium was 1 × 10^17 cm3, and the concentration of the nitrogen was lower 5× 10^16 cm^3, SI-SiC with high resistivity uniformity can be obtained.