印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
7期
40-43
,共4页
遇世友%李宁%谢金平
遇世友%李寧%謝金平
우세우%리저%사금평
石墨%孔金属化%黑孔化%直接电镀
石墨%孔金屬化%黑孔化%直接電鍍
석묵%공금속화%흑공화%직접전도
graphite%plated through hole%black hole process%direct plating
介绍了以石墨作为导电基质，进行印刷电路板孔金属化直接电镀的黑孔新技术，探讨了以石墨分散液在孔壁成膜的过程与导电原理。介绍了黑孔处理的工艺流程，以及黑孔质量与黑孔液稳定性的检测方法。通过孔横截面的金相显微照片确认了通孔与盲孔经过以石墨为导电基质的黑孔液处理后，均能获得完整的电镀铜层。
介紹瞭以石墨作為導電基質，進行印刷電路闆孔金屬化直接電鍍的黑孔新技術，探討瞭以石墨分散液在孔壁成膜的過程與導電原理。介紹瞭黑孔處理的工藝流程，以及黑孔質量與黑孔液穩定性的檢測方法。通過孔橫截麵的金相顯微照片確認瞭通孔與盲孔經過以石墨為導電基質的黑孔液處理後，均能穫得完整的電鍍銅層。
개소료이석묵작위도전기질，진행인쇄전로판공금속화직접전도적흑공신기술，탐토료이석묵분산액재공벽성막적과정여도전원리。개소료흑공처리적공예류정，이급흑공질량여흑공액은정성적검측방법。통과공횡절면적금상현미조편학인료통공여맹공경과이석묵위도전기질적흑공액처리후，균능획득완정적전도동층。
This article describes a new technology of graphite as a conductive matrix used in plated throughhole by direct plating. Surface film formation process and the conductivity principle of the graphite dispersion are investigated in porous. The black hole process and relative test are summarized. It is found that the hole crosssection of both blind holes and through holes after the black hole processes by means of direct plating copper can form a complete copper layer through metallographic photos.
