印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
7期
35-39
,共5页
周珺成%何为%周国云%王守绪
週珺成%何為%週國雲%王守緒
주군성%하위%주국운%왕수서
盲孔%添加剂%填铜%电镀
盲孔%添加劑%填銅%電鍍
맹공%첨가제%전동%전도
blind via%additive%bottom-up filling%electroplating
盲孔孔径的减小对孔金属化工艺提出了新的挑战，盲孔孔金属化采用填铜结构可以有效提高印制电路的稳定性。文章介绍了盲孔电镀工艺中常用的四种添加剂，并对国内外填铜添加剂的研究进展进行了概述。
盲孔孔徑的減小對孔金屬化工藝提齣瞭新的挑戰，盲孔孔金屬化採用填銅結構可以有效提高印製電路的穩定性。文章介紹瞭盲孔電鍍工藝中常用的四種添加劑，併對國內外填銅添加劑的研究進展進行瞭概述。
맹공공경적감소대공금속화공예제출료신적도전，맹공공금속화채용전동결구가이유효제고인제전로적은정성。문장개소료맹공전도공예중상용적사충첨가제，병대국내외전동첨가제적연구진전진행료개술。
The new challenge of via metallization was raised because of the decreased diameter of blind via, the stability of PCB will be improved if＂bottom-up filling＂ was used for blind via metallization. In this paper, four kinds of the most frequently used additives were introduced for blind via filling, the research works of additives used for super filling was also overviewed home and abroad.
