CAJ | 학술논문

已有文献表明，通过适当调整加工参数，可对单晶硅<100>面进行微细超声波塑性加工，大大提高加工材料的表面质量。但传统判别脆塑性去除模式的方法主要是基于主观观测，并没有一个客观评价标准。通过研究发现，表面粗糙度R pk可作为判别微细超声波加工单晶硅<100>面材料去除模式的客观评判标准，并通过实验得到了验证。
이유문헌표명，통과괄당조정가공삼수，가대단정규<100>면진행미세초성파소성가공，대대제고가공재료적표면질량。단전통판별취소성거제모식적방법주요시기우주관관측，병몰유일개객관평개표준。통과연구발현，표면조조도R pk가작위판별미세초성파가공단정규<100>면재료거제모식적객관평판표준，병통과실험득도료험증。
It is possible to obtain ductile machined surface by adjusting properly machining parameters of micro USM in machining single crystal silicon <100>,and the quality of surface is improved significantly. However,traditional methods to identify the brittle or ductile removal modes are based on individual observation and there is not a objective principle of judgement. The surface roughness,Rpk is proposed to be used as the criterion to identify the material removal mode of micro USM in machining single crystal silicon<100>. This criterion is verified by experiments.