印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
3期
48-53
,共6页
阶梯槽%射频%铜基%薄基板
階梯槽%射頻%銅基%薄基闆
계제조%사빈%동기%박기판
Cavity%RF%Copper Substrate%Thin PCB
随着国家3G网络的发展，通信电路板的要求也随着改变。微波损耗较小，介质特性均匀，厚度一致，散热效果好，干燥效果好等要求也越来越高。未来使用射频／微波高频材料＋铜基的PcB需求将进一步加大。研究射频薄基板和铜基压合，并且在薄基板和铜基上都开有阶梯槽，使得产品不仅能满足通信板的要求，而且对滤波和频率的调节也起到很好的作用。
隨著國傢3G網絡的髮展，通信電路闆的要求也隨著改變。微波損耗較小，介質特性均勻，厚度一緻，散熱效果好，榦燥效果好等要求也越來越高。未來使用射頻／微波高頻材料＋銅基的PcB需求將進一步加大。研究射頻薄基闆和銅基壓閤，併且在薄基闆和銅基上都開有階梯槽，使得產品不僅能滿足通信闆的要求，而且對濾波和頻率的調節也起到很好的作用。
수착국가3G망락적발전，통신전로판적요구야수착개변。미파손모교소，개질특성균균，후도일치，산열효과호，간조효과호등요구야월래월고。미래사용사빈／미파고빈재료＋동기적PcB수구장진일보가대。연구사빈박기판화동기압합，병차재박기판화동기상도개유계제조，사득산품불부능만족통신판적요구，이차대려파화빈솔적조절야기도흔호적작용。
With the development of the nation＇s 3G net, the demand of the communication PCB is changing as well. The higher requirement of the PCB are： less microwave loss, self medium characteristic, uniform thickness, better radiation and dry. In the future, the design of RF/microwave material and copper substrate will be used more and more. This article is about the research of thin RF-PCB and copper substrate lamination, and cavity is designed on both thin PCB and copper substrate. The product can not only satisfy the demand of communicate PCB, but also be good at modulating the filtering and frequency.
