CAJ | 학술논문

随着发光二极管（LED）亮度和功率的不断提高，封装材料已成为制约LED进入照明领域的关键技术之一。对于功率型LED封装材料，要求具有高折射率、高透光率、高导热率、耐紫外、耐热老化、低应力、低吸水率等性能特点。目前LED封装用两大主要高分子材料是环氧树脂和有机硅复合材料。对这两种材料的改性主要集中在折射率、耐老化性、导热性、吸水性和力学性能等方面。脂环族环氧树脂及纳米有机硅复合材料作为高功率LED封装材料具有广阔的发展前景。
수착발광이겁관（LED）량도화공솔적불단제고，봉장재료이성위제약LED진입조명영역적관건기술지일。대우공솔형LED봉장재료，요구구유고절사솔、고투광솔、고도열솔、내자외、내열노화、저응력、저흡수솔등성능특점。목전LED봉장용량대주요고분자재료시배양수지화유궤규복합재료。대저량충재료적개성주요집중재절사솔、내노화성、도열성、흡수성화역학성능등방면。지배족배양수지급납미유궤규복합재료작위고공솔LED봉장재료구유엄활적발전전경。
With the development of high-power light emitting diode （HP-LED）, the packaging material of LED has become an important key technique for LED lighting in daily life. As for high-power LED, the characteristics of high refractive index, high transmittance, high thermal conductivity, excellent UV/thermal resistance, low stress and water absorption are required. At present, the polymer materials for LED packaging mainly included epoxy resins and organosilicones, and a lot of researches about modifications of them are focused on improving the refractive index, aging resistance, thermal conductivity, water absorption and mechanical property to satisfy the demands of high-power LED packaging. Among the materials, cycloaliphatic epoxy resins and nano-composite of organosilicones have wide development prospections for high-power LED encapsulations.