兵工学报：英文版
兵工學報：英文版
병공학보：영문판
Journal of China Ordnance
2012年
2期
124-128
,共5页
张辽远%王超%王建光%杨勇
張遼遠%王超%王建光%楊勇
장료원%왕초%왕건광%양용
manufacturing technique and equipment%electroplated diamond wire saw%sawing trajectory%stress analysis%trajectory equation
The cutting process of electroplated diamond wire saw was researched on the basis of impulse and vibration machining theories. The different contact states in the cutting process were analyzed by using the finite element method. It shows that the cutting stress is uniformly distributed along the direction of the workpiece width in the steady state. A mathematical equation of sawing trajectory was established by using the superposition principle and the cutting experiment of wire saw to calculate the cutting trajectory. The comparison of the theoretical trajectory with the calculated one indicates that the error is less than 15%. The research results provide a theoretic basis for optimization of the saw＇ s cutting process parameters.
