CAJ | 학술논문

采用硫代硫酸盐无氰镀银工艺，分别以 AgNO3和 AgBr 为主盐进行镀银。研究主盐含量、电流密度对Ag镀层表面质量、沉积速率和显微硬度的影响，并优化电镀参数。分析优化工艺下的Ag镀层结合强度和晶粒尺寸。结果表明：在AgNO3体系中，AgNO3最佳用量为40 g/L，最佳电流密度为0.25 A/dm2，制备的Ag镀层光亮平整，与基体结合良好，晶粒尺寸为35 nm。在AgBr体系中的最佳AgBr用量为30 g/L，最佳电流密度为0.20 A/dm2，与基体结合良好的Ag镀层的晶粒尺寸为55 nm。与AgBr体系相比，AgNO3体系适用的电镀电流密度范围较宽，制备的Ag镀层显微硬度高，晶粒尺寸小。
채용류대류산염무청도은공예，분별이 AgNO3화 AgBr 위주염진행도은。연구주염함량、전류밀도대Ag도층표면질량、침적속솔화현미경도적영향，병우화전도삼수。분석우화공예하적Ag도층결합강도화정립척촌。결과표명：재AgNO3체계중，AgNO3최가용량위40 g/L，최가전류밀도위0.25 A/dm2，제비적Ag도층광량평정，여기체결합량호，정립척촌위35 nm。재AgBr체계중적최가AgBr용량위30 g/L，최가전류밀도위0.20 A/dm2，여기체결합량호적Ag도층적정립척촌위55 nm。여AgBr체계상비，AgNO3체계괄용적전도전류밀도범위교관，제비적Ag도층현미경도고，정립척촌소。
Cyanide-free silver electroplating was conducted in thiosulfate baths containing AgNO3 and AgBr major salts, respectively. The effects of major salt content and current density on surface quality, deposition rate and microhardness of Ag coatings were investigated. The optimized electroplating parameters were established. The adhesion strength of Ag coating on Cu substrate was evaluated and the grain size of Ag coating was measured under optimized electroplating parameters. The optimized AgNO3 content is 40 g/L with current density of 0.25 A/dm2. The deposited bright, smooth, and well adhered Ag coating had nanocrystalline grains with mean size of 35 nm. The optimized AgBr content was 30 g/L with current density of 0.20 A/dm2. The resultant Ag coating had nanocrystalline grains with mean size of 55 nm. Compared with the bath containing AgBr main salt, the bath containing AgNO3 main salt had a wider current density range, and corresponding Ag coating had a higher microhardness and a smaller grain size.