CAJ | 학술논문

采用钉头凸点工艺进行了倒装芯片上凸点的制备，运用田口试验方法进行设计和试验验证，确定了钉头凸点制备的优化的工艺参数组合。研究结果表明：凸点质量的影响因素依次是超声时间、超声功率和焊接压力，优化的工艺参数组合为超声时间50ms、超声功率0．36w、焊接压力55玎。采用优化后的工艺参数进行凸点制备，获得了稳定性良好的钉头凸点，可满足小批量混合集成微波电路芯片倒装焊接的需要。
채용정두철점공예진행료도장심편상철점적제비，운용전구시험방법진행설계화시험험증，학정료정두철점제비적우화적공예삼수조합。연구결과표명：철점질량적영향인소의차시초성시간、초성공솔화한접압력，우화적공예삼수조합위초성시간50ms、초성공솔0．36w、한접압력55정。채용우화후적공예삼수진행철점제비，획득료은정성량호적정두철점，가만족소비량혼합집성미파전로심편도장한접적수요。
Flip chip bump is made with stud bump bonding technology in this paper, the optimal process pa- rameters of stud bump bonding technology are obtained by using Taguchi method. The results indicate that the factors influencing bump quality are UltraSonic （US） time, US power and welding force in turn, and the opti- mal process parameters are US time about 50 ms, US power about 0.36 W and welding force about 55 gf. Using this bonding of parameters, stud bump with good stability is obtained, which can meet the requirements of flip chip hybrid integrated microwave circuit chip in small batch.