CAJ | 학술논문

制备出一种应用于全印制电子沉铜催化浆料,采用电化学工作站的开路电位-时间（OCP-t）的技术,测定活化浆料引发沉铜的Emix-t曲线,比较不同含银量对引发过程的影响;在此基础上,应用于制造电子标签（RFID）。结果表明：随银含量增大,缓慢生成铜活性中心的诱导时间越短,活性越高;沉铜催化浆料及其对应的工艺加成法制作的电子标签导电性和结合力符合工业化要求,可以作为一种全印制电子技术来推广应用。
제비출일충응용우전인제전자침동최화장료,채용전화학공작참적개로전위-시간（OCP-t）적기술,측정활화장료인발침동적Emix-t곡선,비교불동함은량대인발과정적영향;재차기출상,응용우제조전자표첨（RFID）。결과표명：수은함량증대,완만생성동활성중심적유도시간월단,활성월고;침동최화장료급기대응적공예가성법제작적전자표첨도전성화결합력부합공업화요구,가이작위일충전인제전자기술래추엄응용。
Novel activated slurry with the cross-linking of silver （Ag） was successfully synthesized in this study. Emix-t curve of the activated slurry was measured by Open potential-time（OCP-t） technology in Electrochemical workstations. From the Emix-t curve, We could know that the induce time x of activated slurry became shorter and the catalytic activity was higher as the silver concentration increased. The conductivity and binding force of RFID tags both corresponded with standard of industrialization, which were manufactured by technology of activated slurry. So, this technology was widely applied to the field of Print Full Electronic Technology.