CAJ | 학술논문

近年来,随着PCB的迅猛发展,PCB的设计也日新月异。对于台阶板的制作,目前业内主要是采用先内层开槽,压合前填充缓冲材料,压合后控深开盖取出缓冲材料的工艺生产。介绍了几种激光成型在台阶板加工中的应用方法,这些方法可以弥补常规方法无法实现的效果,满足有特殊要求的板件制作。
근년래,수착PCB적신맹발전,PCB적설계야일신월이。대우태계판적제작,목전업내주요시채용선내층개조,압합전전충완충재료,압합후공심개개취출완충재료적공예생산。개소료궤충격광성형재태계판가공중적응용방법,저사방법가이미보상규방법무법실현적효과,만족유특수요구적판건제작。
In recent years, the PCB design is also changing accordingly with the rapid development of PCB. For the step boards, the production technology in the PCB industrial is cutting the slot and filling the buffer material before the lamination, after lamination using the control depth routing to remove the buffer material. This thesis introduces several kinds of the laser shape which were applied in the manufacturing of the depth boards. This applications and methods can be served as remedy for the normal manufacturing process and also satisfy the manufacturing of the special boards.