CAJ | 학술논문

概述了目前印制电路板制造中激光在成像和钻孔的主要应用;重点介绍了利用激光直接成像技术进行的精细线路制作,在激光钻孔工艺中采用激光诱发进行直接电镀以及在AlN陶瓷基板上进行激光辅助活化制作线路和孔;并提出了今后的发展方向。
개술료목전인제전로판제조중격광재성상화찬공적주요응용;중점개소료이용격광직접성상기술진행적정세선로제작,재격광찬공공예중채용격광유발진행직접전도이급재AlN도자기판상진행격광보조활화제작선로화공;병제출료금후적발전방향。
The main applications of laser at present are imaging and drilling in PCB manufacturing. The use of laser direct imaging technique in fine lines fabrication, the laser-induced direct plating in the laser drilling process and the laser-assisted activation in the line and hole production on AIN ceramic substrates are introduced in detail and the development directions of Laser Application are proposed.