印制电路信息
印製電路信息
인제전로신식
PRINTED CIRCUIT INFORMATION
2012年
4期
1-5
,共5页
厚铜PCB%水池效应%蚀刻因子
厚銅PCB%水池效應%蝕刻因子
후동PCB%수지효응%식각인자
heavy copper%pool effect%etch factor
结合厚铜PCB（205.7μm/205.7μm）的蚀刻实践和理论分析,找出了水池效应是影响厚铜线路蚀刻因子的重要原因,提出了从喷淋和板面设计两方面改善厚铜板蚀刻效果的建议并进行了实验验证,对厚铜板线路的蚀刻有一定价值的参考意义。
結閤厚銅PCB（205.7μm/205.7μm）的蝕刻實踐和理論分析,找齣瞭水池效應是影響厚銅線路蝕刻因子的重要原因,提齣瞭從噴淋和闆麵設計兩方麵改善厚銅闆蝕刻效果的建議併進行瞭實驗驗證,對厚銅闆線路的蝕刻有一定價值的參攷意義。
결합후동PCB（205.7μm/205.7μm）적식각실천화이론분석,조출료수지효응시영향후동선로식각인자적중요원인,제출료종분림화판면설계량방면개선후동판식각효과적건의병진행료실험험증,대후동판선로적식각유일정개치적삼고의의。
This article combines the practice ot etching oI neavy copper PCB（205.7μm/205.7μm） etching theory. The important factor has been found that the pool effect has great impact on etch factor of heavy copper PCB. Two improvement suggestions about etch spray and PCB design were proposed and it was verified by experiment. It will be some significant to the line etching of heavy copper PCB.
