CAJ | 학술논문

LED因其高效化、高功率化、高可靠性和低成本的不断发展， LED封装技术在越发重要的同时面临巨大的挑战。在封装过程中，封装材料和封装结构对LED散热与出光的影响最为关键。本文主要从封装材料（芯片、基板、热界面材料、荧光粉）和封装结构（ Lamp、 Surface Mounted Devices （ SMD ）、 Chip on Board （ CoB ）、 Remote Phosphor （ RP））上，阐述LED封装的研究现状以及发展趋势。
LED인기고효화、고공솔화、고가고성화저성본적불단발전， LED봉장기술재월발중요적동시면림거대적도전。재봉장과정중，봉장재료화봉장결구대LED산열여출광적영향최위관건。본문주요종봉장재료（심편、기판、열계면재료、형광분）화봉장결구（ Lamp、 Surface Mounted Devices （ SMD ）、 Chip on Board （ CoB ）、 Remote Phosphor （ RP））상，천술LED봉장적연구현상이급발전추세。
With the development of efficiency , high power , high reliability and low cost , LED packaging technology becomes more important , while facing enormous challenges .In the process of packaging , materials and structures are key factors in heat dissipation and light extraction .This paper mainly described research status and development trends of LED packaging from materials ( chips , substrates , thermal interface materials, phosphors) and structures (Lamp, Surface Mounted Devices (SMD), Chip on Board (CoB), Remote phosphor (RP)).