基于ARM和FPGA的SiP系统级封装设计
기우ARM화FPGA적SiP계통급봉장설계
Design of system in package based on ARM and FPGA
  • 万方数据
    微型机与应用 미형궤여응용
    MICROCOMPUTER & ITS APPLICATIONS
    2014年 1期 25-27 ,共3页

    代明清%韩强%邓豹%段小虎

    대명청%한강%산표%단소호

    系统级封装%ARM%FPGA%管芯 繫統級封裝%ARM%FPGA%管芯
    계통급봉장%ARM%FPGA%관심
    system in package%ARM%FPGA%chip core
    介绍了系统级封装的概念和特性，阐述了 SiP 设计的关键技术和基本生产实现流程。设计了一款基于 ARM 和 FPGA 管芯的 SiP 通用微处理系统，介绍了该 SiP 系统的整体框图，并详细分析了系统各部分电路的功能结构。该系统具有体积小、功耗低及功能完备等优点，充分展现了 SiP 技术的优越性。
    개소료계통급봉장적개념화특성，천술료 SiP 설계적관건기술화기본생산실현류정。설계료일관기우 ARM 화 FPGA 관심적 SiP 통용미처리계통，개소료해 SiP 계통적정체광도，병상세분석료계통각부분전로적공능결구。해계통구유체적소、공모저급공능완비등우점，충분전현료 SiP 기술적우월성。
    The concept and characteristics of SiP are introduced in the paper, and the key design technologies and produce flows are illustrated. A micro-processing system based on ARM and FPGA chip cores is designed in SiP form. The paper describes the overall structure and hardware circuits of the system in detail. The system has advantages like small, low consumption, complete functions etc, and the excellence performances of SiP are adequately displayed in the system.
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