CAJ | 학술논문

为了解决不同工艺参数组合下激光焊接 QFP器件后其器件的温度场分布问题,选取激光焊接有效功率、时间和光斑面积3个工艺参数,采用有限元软件 ANSYS,对特定 QFP 器件激光软钎焊温度场的分布进行模拟。仿真结果表明：激光焊接有效功率、光斑面积与焊点处的最高温度几乎为线性关系,焊接时间与焊点处的最高温度为正相关关系,且切线斜率逐渐减小；当焊接有效功率为1~4 W,焊接时间为1~2 s,光斑面积为0.03~0.11 mm2,封装体、印制板、焊点温度最高分别可达240、350、510℃。仿真结果为激光软钎焊工艺参数的预选提供参考,并为相关产品激光软钎焊的综合参数优化打下基础。
위료해결불동공예삼수조합하격광한접 QFP기건후기기건적온도장분포문제,선취격광한접유효공솔、시간화광반면적3개공예삼수,채용유한원연건 ANSYS,대특정 QFP 기건격광연천한온도장적분포진행모의。방진결과표명：격광한접유효공솔、광반면적여한점처적최고온도궤호위선성관계,한접시간여한점처적최고온도위정상관관계,차절선사솔축점감소；당한접유효공솔위1~4 W,한접시간위1~2 s,광반면적위0.03~0.11 mm2,봉장체、인제판、한점온도최고분별가체240、350、510℃。방진결과위격광연천한공예삼수적예선제공삼고,병위상관산품격광연천한적종합삼수우화타하기출。
In order to solve the problem of temperature distribution of the QFP device after the laser soldering under different process parameters,three welding parameters (effective power,time,and spot area)are selected,the finite element soft-ware ANSYS is used to simulate temperature field distribution of the specific QFP device.The simulation result shows that laser welding effective power and spot area are almost linear relationship with the highest temperature of the solder joint, and that time is positive correlation in which the tangent slope decreases slowly.When the effective power is in 1-4 W,time is in 1-2 s and spot area is in 0.03-0.1 1 mm2 ,the highest temperature of plastic package,printed board and solder joint can reach 240,350,5 10 ℃.The simulation results can provide references for primary election of the laser welding technological parameter and lay a basis for the laser soldering integrated parameters optimization of relative products.