CAJ | 학술논문

以半导体互连材料铜为对象，研究铜表面划痕过程声发射特征，探索划痕载荷及速度对划痕过程声发射特征影响及铜表面划痕损伤机制，为基于声发射技术表征铜表面微纳尺度材料去除过程提供理论依据。研究发现，铜划痕过程主要以塑性变形为主，呈现周期变化形貌，并产生连续型声发射信号；随划痕速度的增加，信号强度增加，而载荷变化对信号影响较小；信号强度与变形体积增加速率呈指数关系。声发射信号能较好表征划痕过程。
이반도체호련재료동위대상，연구동표면화흔과정성발사특정，탐색화흔재하급속도대화흔과정성발사특정영향급동표면화흔손상궤제，위기우성발사기술표정동표면미납척도재료거제과정제공이론의거。연구발현，동화흔과정주요이소성변형위주，정현주기변화형모，병산생련속형성발사신호；수화흔속도적증가，신호강도증가，이재하변화대신호영향교소；신호강도여변형체적증가속솔정지수관계。성발사신호능교호표정화흔과정。
Acoustic emission(AE)technique is widely used in monitoring material machining process.Scratch is an important removal mechanism during material removal, especially in precision machining. So, it's valuable to investigate AE characteristics of scratch.AE characteristics of scratch on copper surface were considered,and the effects of load and velocity on AE and copper removal mechanism during scratch were analyzed,giving theoretical support for monitoring nano-or micro-removal process on copper surface with AE.The results show:copper deforms mainly plastically during scratch with a periodically changing morphology,generating continuous AE signal.The signal power increases as the scratch velocity increases,while the load has less effect on AE signal.The signal power has an exponential relation with the increase rate of deformed volume.The results show that AE can characterize the scratch process to some extent.