CAJ | 학술논문

密封微电子器件在对可靠性要求较高领域占有绝对的地位，为了研究长期室内自然贮存对密封微电子封装性能的影响，对贮存在北京某研究所库房的多种气密性封装微电子器件进行试验分析。运用破坏性物理分析（DPA）方法检验样品的密封性、内部形貌、键合强度和芯片粘贴强度等，总结出长期贮存对气密性封装器件封装性能影响的结论；并根据密封性测试结果对器件分组，分别得到密封合格与不合格产品长期贮存后封装性能的实测数据，对密封性能对元器件贮存可靠性的影响进行研究，为元器件的筛选和贮存提供借鉴。
밀봉미전자기건재대가고성요구교고영역점유절대적지위，위료연구장기실내자연저존대밀봉미전자봉장성능적영향，대저존재북경모연구소고방적다충기밀성봉장미전자기건진행시험분석。운용파배성물리분석（DPA）방법검험양품적밀봉성、내부형모、건합강도화심편점첩강도등，총결출장기저존대기밀성봉장기건봉장성능영향적결론；병근거밀봉성측시결과대기건분조，분별득도밀봉합격여불합격산품장기저존후봉장성능적실측수거，대밀봉성능대원기건저존가고성적영향진행연구，위원기건적사선화저존제공차감。
Hermetic package components have an absolute monopoly position in condition which requires high reliability. To study about the influence of long-term storage on the package performance of hermetic package microelectronic components, several kinds of hermetic package microelectronic components stored in a storeroom in a Beijing research institute were analyzed. A conclusion on the influence of long-term storage on the package performance of hermetic package components was achieved with destructive physical analysis(DPA)methods as seal test to carry out seal performance,internal morphology,bond strength and chip bonding intensity test. The stored components were classified according to the results of seal performance test. The package performance data of qualified and unqualified products in long-term storage was obtained. The influence of seal perfor-mance on storage reliability was researched. All this does great help for screening and long-tern storage of hermetic package com-ponents.