CAJ | 학술논문

在微电子产品设计阶段，若使用层次法分析微电子产品各项性能，就可以保证在设计阶段优化产品设计和材料选择，改善工艺，从而减少可能的失效。文章通过对微软公司某款微电子产品封装可靠性的模糊评价发现，该电子产品的可靠性各项指标及综合性能都很好，并且从二级指标的评价中还看出机械可靠性虽然很好，但隶属度偏低，如果要优化该产品的封装可靠性可以从机械可靠性方面入手。文章首次将为层次模糊评价法应用在微电子封装领域，为封装设计提供理论基础和参考。
재미전자산품설계계단，약사용층차법분석미전자산품각항성능，취가이보증재설계계단우화산품설계화재료선택，개선공예，종이감소가능적실효。문장통과대미연공사모관미전자산품봉장가고성적모호평개발현，해전자산품적가고성각항지표급종합성능도흔호，병차종이급지표적평개중환간출궤계가고성수연흔호，단대속도편저，여과요우화해산품적봉장가고성가이종궤계가고성방면입수。문장수차장위층차모호평개법응용재미전자봉장영역，위봉장설계제공이론기출화삼고。
In the microelectronics product design stage, the use of hierarchical analysis of the performance of micro-electronic products, we can guarantee the design phase to optimize product design and material selection, process improve-ment, thereby reducing the possible failure. A section through the Microsoft article microelectronics packaging reliability fuzzy evaluation found that the reliability of electronic products and comprehensive performance indicators are good, and the evaluation of the index from the two mechanical reliability is also seen, although very good, but membership is low, if you want to optimize the reliability of the product package from mechanical reliability aspects. Article first level fuzzy e-valuation method will be applied in the field of microelectronics packaging, designed to provide a theoretical basis for the package and reference.