电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2012年
3期
41-44
,共4页
线切割%翘曲度%切割速度
線切割%翹麯度%切割速度
선절할%교곡도%절할속도
Multi-wire slicing%Warp%Slicing speed
根据线切割机的工作原理，综合考虑了砂浆中磨料在磨削过程中的变化以及单晶直径的变化，确定了变速切割的工艺方法，同时考虑到125mm单晶直径大、SIC磨削路线长、磨削发热量大，制定了包括线速度、耗线量、砂浆温度、砂浆流量以及各部分温度的工艺参数。通过该工艺参数进行了切割实验，验证了该工艺参数下切割的晶片可以满足要求。
根據線切割機的工作原理，綜閤攷慮瞭砂漿中磨料在磨削過程中的變化以及單晶直徑的變化，確定瞭變速切割的工藝方法，同時攷慮到125mm單晶直徑大、SIC磨削路線長、磨削髮熱量大，製定瞭包括線速度、耗線量、砂漿溫度、砂漿流量以及各部分溫度的工藝參數。通過該工藝參數進行瞭切割實驗，驗證瞭該工藝參數下切割的晶片可以滿足要求。
근거선절할궤적공작원리，종합고필료사장중마료재마삭과정중적변화이급단정직경적변화，학정료변속절할적공예방법，동시고필도125mm단정직경대、SIC마삭로선장、마삭발열량대，제정료포괄선속도、모선량、사장온도、사장류량이급각부분온도적공예삼수。통과해공예삼수진행료절할실험，험증료해공예삼수하절할적정편가이만족요구。
As the theory of the multi-wire slicing process, the silicon ingot would move down while the wire kept the same horizontal position during the slicing process, so the slicing speed would be changed with the relation between the wire and the ingot. With the diameter of the silicon ingot increased, the quantity of heat would be remarkably increased, so the slicing process would be determined including the wire speed, the abrasive temperature, the abrasive flow and the unit temperature. The article was addressed on the effect of the slicing speed graphs on warp of the silicon sliced wafers in the multi-wire slicing.
