电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2012年
2期
71-74,105
,共5页
Sn0.3Ag0.7Cu焊锡膏%焊接性能%铺展率%储存稳定性
Sn0.3Ag0.7Cu銲錫膏%銲接性能%鋪展率%儲存穩定性
Sn0.3Ag0.7Cu한석고%한접성능%포전솔%저존은정성
SnO.3AgO.7Cu solder paste%Soldering performance%Spreading ratio%Storage stability
研究了多元醇类溶剂及其复配物对Sn0.3Ag0.7Cu焊膏性能的影响。结果表明：四氢糠醇和聚丙二醇对冰白和水白松香都具有较强的溶解性。当四氢糠醇和聚丙二醇以质量比9：1复配时,获得的焊膏平均铺展率可达87%以上,焊点完整、饱满、无焊球和桥连等缺陷,储存时间较长,是一种综合性能良好的焊膏。
研究瞭多元醇類溶劑及其複配物對Sn0.3Ag0.7Cu銲膏性能的影響。結果錶明：四氫糠醇和聚丙二醇對冰白和水白鬆香都具有較彊的溶解性。噹四氫糠醇和聚丙二醇以質量比9：1複配時,穫得的銲膏平均鋪展率可達87%以上,銲點完整、飽滿、無銲毬和橋連等缺陷,儲存時間較長,是一種綜閤性能良好的銲膏。
연구료다원순류용제급기복배물대Sn0.3Ag0.7Cu한고성능적영향。결과표명：사경강순화취병이순대빙백화수백송향도구유교강적용해성。당사경강순화취병이순이질량비9：1복배시,획득적한고평균포전솔가체87%이상,한점완정、포만、무한구화교련등결함,저존시간교장,시일충종합성능량호적한고。
Study the effect of polyatomic alcohol and the mixed solvents on the performance of SnO.3AgO.7Cu lead-free solder paste. The results show that both tetrahydrofurfuryl alcohol and polypropylene glycol have high solvability to ice-white rosin and water-white rosin. When tetrahydrofurfuryl alcohol and polypropylene glycol compounded with the mass ratio of 9 ： 1 are used as solvent, get a kind of solder paste which has good combination property-over 87% spreading ratio, long storage time, integral and plump solder joint with no defect of solder ball and bridging, etc.
